Evaluation of fan-out wafer level package using 200 ?C curable positive-tone photodefinable polybenzoxazoles.
Autor: | Nishimura, Masato, Toba, Masaya, Matsuie, Noritaka, Motobe, Takeharu, Ohe, Masayuki |
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Zdroj: | 2015 IEEE CPMT Symposium Japan (ICSJ); 2015, p25-28, 4p |
Databáze: | Complementary Index |
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