Evaluation of fan-out wafer level package using 200 ?C curable positive-tone photodefinable polybenzoxazoles.

Autor: Nishimura, Masato, Toba, Masaya, Matsuie, Noritaka, Motobe, Takeharu, Ohe, Masayuki
Zdroj: 2015 IEEE CPMT Symposium Japan (ICSJ); 2015, p25-28, 4p
Databáze: Complementary Index