A high-density 300-Gbit/s parallel optical interconnect module with efficient thermal dissipation characteristics.
| Autor: | Takai, Toshiaki, Chujo, Norio, Matsushima, Naoki, Matsuoka, Yasunobu, Yong Lee, Arimoto, Hideo, Sato, Masataka, Komatsuzaki, Shinji, Ogura, Akira, Yamazaki, Kinya, Sunaga, Yoshinori |
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| Zdroj: | 2015 IEEE CPMT Symposium Japan (ICSJ); 2015, p5-8, 4p |
| Databáze: | Complementary Index |
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