Reliability behaviors of an exposed die FCCSP on a substrate with ultra-low CTE laminate material.
| Autor: | Ren-Shin Cheng, Chau-Jie Zhan, Su-Yu Fun, Su-Ching Chung, Kuo-Chyuan Chen, Yu-Lan Lu, Chia-Wen Fan, Tao-Chih Chang |
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| Zdroj: | 2015 10th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 2015, p241-244, 4p |
| Databáze: | Complementary Index |
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