High-speed serial link challenges using multi-level signaling.
| Autor: | Dikhaminjia, N., He, J., Hernandez, E., Tsiklauri, M., Drewniak, J., Chada, A., Zvonkin, M., Mutnury, B. |
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| Zdroj: | 2015 IEEE 24th Electrical Performance of Electronic Packaging & Systems (EPEPS); 2015, p57-60, 4p |
| Databáze: | Complementary Index |
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