Nitrogen influence on the reflow soldering process optimization.
| Autor: | Trip, Nistor Daniel, Burca, Adrian, Gordan, Cornelia, Schiop, Adrian |
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| Zdroj: | 2015 IEEE 21st International Symposium for Design & Technology in Electronic Packaging (SIITME); 2015, p99-102, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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