Thermal analysis and reliability evaluation on high power flip chip LED.
| Autor: | Lu, Guo-guang, Hao, Ming-ming, Lai, Can-xiong, Yao, Bin |
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| Zdroj: | 2015 12th China International Forum on Solid State Lighting (SSLCHINA); 2015, p43-46, 4p |
| Databáze: | Complementary Index |
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