Analyses of diamond wire sawn wafers: Effect of various cutting parameters.
Autor: | Sopori, Bhushan, Basnyat, Prakash, Devayajanam, Srinivas, Schnepf, Rekha, Sahoo, Santosh, Gee, James, Severico, Ferdinando, Manens, Antoine, Seigneur, Hubert, Schoenfeld, Winston V., Preece, Steve |
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Zdroj: | 2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC); 2015, p1-6, 6p |
Databáze: | Complementary Index |
Externí odkaz: |