Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC.
| Autor: | Kino, Hisashi, Hashiguchi, Hideto, Tanikawa, Seiya, Sugawara, Yohei, Ikegaya, Shunsuke, Fukushima, Takafumi, Koyanagi, Mitsumasa, Tanaka, Tetsu |
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| Zdroj: | 2015 International 3D Systems Integration Conference (3DIC); 2015, pTS8.26.1-TS8.26.4, 0p |
| Databáze: | Complementary Index |
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