300 mm InGaAsOI substrate fabrication using the Smart CutTM technology.
| Autor: | Sollier, S., Widiez, J., Gaudin, G., Mazen, F., Baron, T., Martin, M., Roure, M C., Besson, P., Morales, C., Beche, E., Fournel, F., Favier, S., Salaun, A., Gergaud, P., Cordeau, M., Veytizou, C., Ecarnot, L., Delprat, D., Radu, I., Signamarcheix, T. |
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| Zdroj: | 2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S); 2015, p1-2, 2p |
| Databáze: | Complementary Index |
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