Influence of packaging materials on GaN RF power devices.
| Autor: | Buchta, M., Thorpe, J., Blanck, H., Beilenhoff, K., Floriot, D., Kuball, M., Mrotzek, T., Knippscheer, S., Courtade, F., Xiong, A. |
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| Zdroj: | 2015 IEEE MTT-S International Microwave Workshop Series on Advanced Materials & Processes for RF & THz Applications (IMWS-AMP); 2015, p1-3, 3p |
| Databáze: | Complementary Index |
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