Sub-90nm pitch Cu low-k interconnect etch solution using RF pulsing technology.
| Autor: | Liao, J H, Lai, Yu Tsung, Wan, Stan, Kuo, Brandon, Gopaladasu, Prabhakara, Wei, David, Yao, Sean, Lin, Wesley, Wang, Ivan, Lin, Paul, Finch, Barrett, Deshmukh, Shashank |
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| Zdroj: | 2015 IEEE International Interconnect Technology Conference & 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM); 2015, p131-134, 4p |
| Databáze: | Complementary Index |
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