Materials challenges for III-V/Si co-integrated CMOS.
| Autor: | Sadana, D. K., Cheng, C.-W., Wacaser, B., Spratt, W., Shiu, K.T., Bedell, S.W. |
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| Zdroj: | 2015 IEEE Custom Integrated Circuits Conference (CICC); 2015, p1-6, 6p |
| Databáze: | Complementary Index |
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