Key process development on 300mm wafer for 2.5D/3D integration.
| Autor: | Song, Chongshen, Xue, Kai, Jiang, Feng, Li, Hengfu, Feng, Guangjian, Jing, Xiangmeng, Zhang, W. |
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| Zdroj: | 2015 International Conference on Optical MEMS & Nanophotonics (OMN); 2015, p241-244, 4p |
| Databáze: | Complementary Index |
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