A novel approach for ESD-immunity analysis using channel transfer impedance on the power delivery network of a large-scale integration chip.
Autor: | Moon, Sungwook, Lee, Jihyun, Lee, Jaeyoul |
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Zdroj: | 2015 IEEE International Symposium on Electromagnetic Compatibility (EMC); 2015, p920-923, 4p |
Databáze: | Complementary Index |
Externí odkaz: |