Advanced plating photoresist development for advanced IC packages.
| Autor: | Sakakibara, Hirokazu, Akimaru, Hisanori, Hiro, Akito, Sato, Keiichi, Fujiwara, Koichi, Okamoto, Kenji, Hasegawa, Kouichi, Kusumoto, Shiro |
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| Zdroj: | 2015 16th International Conference on Electronic Packaging Technology (ICEPT); 2015, p1348-1351, 4p |
| Databáze: | Complementary Index |
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