The effects of Au film thickness on the reliability of Sn-Pb solder joints.
| Autor: | Lv, Xiaorui, Lin, Pengrong, Huang, Yingzhuo, Jiang, Xueming, Lian, Binhao, Yao, Quanbin |
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| Zdroj: | 2015 16th International Conference on Electronic Packaging Technology (ICEPT); 2015, p1321-1324, 4p |
| Databáze: | Complementary Index |
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