iNEMI project on automotive electronic material challenges.

Autor: Schaffer, Mark, Sandy-Smith, Brook, Obeng, Yaw, Lee, Jeffrey, Chen, WangChu, Lee, Dem, Liou, Peggy
Zdroj: 2015 16th International Conference on Electronic Packaging Technology (ICEPT); 2015, p522-525, 4p
Databáze: Complementary Index