iNEMI project on automotive electronic material challenges.
Autor: | Schaffer, Mark, Sandy-Smith, Brook, Obeng, Yaw, Lee, Jeffrey, Chen, WangChu, Lee, Dem, Liou, Peggy |
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Zdroj: | 2015 16th International Conference on Electronic Packaging Technology (ICEPT); 2015, p522-525, 4p |
Databáze: | Complementary Index |
Externí odkaz: |