Comparative study on sample preparation techniques for Cu-Al interfacial analysis.
Autor: | Yeoh, Lai-Seng, del Rosario, Amalia, Tam, Chee-Wah, Chong, Kok-Cheng, Li, Susan, Adem, Ercan, Tracy, Bryan |
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Zdroj: | 2015 IEEE 22nd International Symposium on the Physical & Failure Analysis of Integrated Circuits; 2015, p455-458, 4p |
Databáze: | Complementary Index |
Externí odkaz: |