Comparative study on sample preparation techniques for Cu-Al interfacial analysis.

Autor: Yeoh, Lai-Seng, del Rosario, Amalia, Tam, Chee-Wah, Chong, Kok-Cheng, Li, Susan, Adem, Ercan, Tracy, Bryan
Zdroj: 2015 IEEE 22nd International Symposium on the Physical & Failure Analysis of Integrated Circuits; 2015, p455-458, 4p
Databáze: Complementary Index