Thermal characterization of a printed circuit board with thermal vias for the application of high brightness light-emitting diodes.
| Autor: | Mian Tao, Zicheng Feng, Swanson, John, Ganjei, John, Lo, Jeffery C. C., Lee, S. W. Ricky |
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| Zdroj: | 2013 10th China International Forum on Solid State Lighting (ChinaSSL); 2013, p128-131, 4p |
| Databáze: | Complementary Index |
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