A new staircase test method for copper via electromigration on CMOS wafers.
| Autor: | Seong, Kirby Tan Kheng, Kordesch, Albert Victor, Shahar, Aftanasar Md. |
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| Zdroj: | 2015 China Semiconductor Technology International Conference; 2015, p1-4, 4p |
| Databáze: | Complementary Index |
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