The influence of high melting point elements on the reliability of solder during thermal shocks.
| Autor: | Zhong, Ying, Wang, Chunqing, Zhao, Xiujuan, Caers, J.F.J.M. |
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| Zdroj: | 2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p2162-2167, 6p |
| Databáze: | Complementary Index |
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