Reliability assessment of thermally compression bonded copper pillar on organic and ceramic substrates.
| Autor: | Bhattacharya, Swapan K., Lewis, Brian, Wu, Han, Hodge, Kelley, Xie, Fei, Pathammavong, Keck, Houston, Paul N., Baldwin, Daniel F. |
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| Zdroj: | 2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p2077-2082, 6p |
| Databáze: | Complementary Index |
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