Degradation of Cu-Al wire bonded contacts under high current and high temperature conditions using in-situ resistance monitoring.
| Autor: | Rongen, Rene, van IJzerloo, Arjan, Mavinkurve, Amar, O'Halloran, G.M. |
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| Zdroj: | 2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p1396-1402, 7p |
| Databáze: | Complementary Index |
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