2-die wafer-level chip scale packaging enables the smallest TCXO for mobile and wearable applications.
| Autor: | Arumugam, Niveditha, Hill, Ginel, Clark, Guy, Arft, Carl, Grosjean, Charles, Palwai, Rajkumar, Pedicord, Jim, Hagelin, Paul, Partridge, Aaron, Menon, Vinod, Gupta, Pavan |
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| Zdroj: | 2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p1338-1342, 5p |
| Databáze: | Complementary Index |
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