Challenges of flip chip packaging with embedded fine line and multi-layer coreless substrate.
| Autor: | Tang, Tom, Lan, Albert, Tsai, Jensen, Lin, Steven, Ho, David, You, Jake |
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| Zdroj: | 2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p1219-1222, 4p |
| Databáze: | Complementary Index |
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