0.35mm pitch wafer level package board level reliability: Studying effect of ball de-population with varying ball size.
| Autor: | Keser, Beth, Alvarado, Rey, Schwarz, Mark, Bezuk, Steve |
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| Zdroj: | 2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p1090-1095, 6p |
| Databáze: | Complementary Index |
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