Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes.
| Autor: | Guo, Wei, Karmarkar, Aditya P., Xu, Xiaopeng, Van der Plas, Geert, Van Huylenbroeck, Stefaan, Gonzalez, Mario, Absil, Philippe, El Sayed, Karim, Beyne, Eric |
|---|---|
| Zdroj: | 2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p1038-1044, 7p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|