Reliability of copper wirebonds over through-silicon vias for SiGe power amplifiers.
| Autor: | Gambino, Jeff, Graf, Rich, Guthrie, Bill, Salimeno, Jim, Nuzback, Jerry |
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| Zdroj: | 2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p656-660, 5p |
| Databáze: | Complementary Index |
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