Alternative fine pitch solution of low cost and high throughput thermal compression bonding by using capillary underfill.
| Autor: | Tsai, Mike, Lan, Albert, Yao, Yan Han, Wu, Meng Yueh, Chang, Cheng Kai, Lo, Roger, Chen, Eason |
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| Zdroj: | 2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p465-469, 5p |
| Databáze: | Complementary Index |
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