The mechanism and kinetic study of void migration in Cu vias under current flow by 3D X-ray computed tomography.
| Autor: | Li, Yan, Xu, Luhua, Liu, Pilin, Pathangey, Balu, Pacheco, Mario, Hossain, Mohammad, Hu, Liang, Dias, Rajen, Goyal, Deepak |
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| Zdroj: | 2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p432-437, 6p |
| Databáze: | Complementary Index |
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