Embedded glass interposer for heterogeneous multi-chip integration.
| Autor: | Hu, Dyi-Chung, Hung, Yin-Po, Chen, Yu Hua, Tain, Ra-Min, Lo, Wei-Chun |
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| Zdroj: | 2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p314-317, 4p |
| Databáze: | Complementary Index |
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