Stress and bowing engineering in passive silicon interposer.
| Autor: | Detalle, Mikael, Vandevelde, B., Nolmans, P., Miller, A., La Manna, A., Beyer, G., Beyne, E. |
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| Zdroj: | 2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p287-292, 6p |
| Databáze: | Complementary Index |
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