Fabrication and characterization of mixed-signal polymer-enhanced silicon interposer featuring photodefined coax TSVs and high-Q inductors.

Autor: Thadesar, Paragkumar A., Bakir, Muhannad S.
Zdroj: 2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p281-286, 6p
Databáze: Complementary Index