Electro-less barrier/seed formation in high aspect ratio via.

Autor: Tanaka, Takashi, Iwashita, Mitsuaki, Toshima, Takayuki, Fujita, Keiichi, Chen, James
Zdroj: 2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p78-82, 5p
Databáze: Complementary Index