Silicon-silicon anodic bonding process with embedded glass.
| Autor: | Cui, W. P, Liu, G. D., Zhang, F. S., Hu, H., Gao, C. C., Hao, Y. L. |
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| Zdroj: | 10th IEEE International Conference on Nano/Micro Engineered & Molecular Systems; 2015, p470-475, 6p |
| Databáze: | Complementary Index |
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