Metal film bridge with TSV-based 3D wafer level packaging.
| Autor: | Yunlong Guo, Wenzhong Lou, Xuran Ding |
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| Zdroj: | 10th IEEE International Conference on Nano/Micro Engineered & Molecular Systems; 2015, p430-434, 5p |
| Databáze: | Complementary Index |
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