| Autor: |
Yoon, Sang-Woong, Dang, Trung-Sinh, Lai, Ngoc-Duy-Hien, Park, Jae Y. |
| Předmět: |
|
| Zdroj: |
IEEE Transactions on Components, Packaging & Manufacturing Technology; Jul2015, Vol. 5 Issue 7, p887-894, 8p |
| Abstrakt: |
This paper presents a power amplifier module (PAM) that operates efficiently in low-power mode for IEEE 802.11g Wi-Fi applications. The PAM consists of a power amplifier (PA), a buck converter, and a power detector. Two packaging technologies were used to integrate the compact module: a low-temperature co-fired ceramic (LTCC) technology and a ferrite-filled printed circuit board (PCB) technology. The LTCC portion includes radio-frequency inductors, capacitors, transmission lines, and interconnection lines to minimize the overall size, while a power inductor for the buck converter is implemented in ferrite-filled PCB. The PA and the buck converter are designed in 2- \mu \textm InGaP/GaAs heterojunction bipolar transistor technology and 0.35- \mu \textm CMOS technology, respectively. The output power level is converted into a voltage by the power detector, and the voltage controls the buck converter, thereby optimizing the supply voltage of the PA. This adaptive supply voltage helps to improve the power-added efficiency (PAE) in the low-power regime while maintaining linearity. The PAM showed an error vector magnitude of less than 4% up to an output power of 22 dBm. The PAE is 8% and 11% at output powers of 11 and 16 dBm, respectively, representing respective improvements of 60% and 43%. The overall size of the PAM is $5 \times 7.5 \times 1.2$ mm ^{\mathrm {\mathbf {3}}} . [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
|
