High reliability packaging technologies for 175deg.C continuous operation in IGBT module.
| Autor: | Saito, T., Nishimura, Y., Momose, F., Hirao, A., Morozumi, A., Tamai, Y., Mochizuki, E., Takahashi, Y. |
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| Zdroj: | 2015 International Conference on Electronic Packaging & iMAPS All Asia Conference (ICEP-IAAC); 2015, p791-794, 4p |
| Databáze: | Complementary Index |
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