Warpage modeling technique of organic interposer considering deformation by insulator material shrinkage.
| Autor: | Okamoto, Keishi, Kohara, Sayuri, Noma, Hirokazu, Toriyama, Kazushige, Mori, Hiroyuki |
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| Zdroj: | 2015 International Conference on Electronic Packaging & iMAPS All Asia Conference (ICEP-IAAC); 2015, p771-775, 5p |
| Databáze: | Complementary Index |
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