Effect of silver content and vacuum reflow soldering on thermal fatigue life of Sn-Ag-Cu solder.
| Autor: | Yamabe, Mitsuharu |
|---|---|
| Zdroj: | 2015 International Conference on Electronic Packaging & iMAPS All Asia Conference (ICEP-IAAC); 2015, p590-595, 6p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|