A study of chip-last embedded FCCSP.
| Autor: | Shin-Hua Chao, Chih-Pin Hung, Yishao Lai, Liu, Colin, Hsieh, Emma, Ding-Bang Luh |
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| Zdroj: | 2015 International Conference on Electronic Packaging & iMAPS All Asia Conference (ICEP-IAAC); 2015, p78-82, 5p |
| Databáze: | Complementary Index |
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