Evaluation of plasma process damage during TSV formation and damage reduction method.
| Autor: | Igarashi, Takatoshi, Kojima, Kazuaki, Matsumoto, Kazuya, Fujimori, Noriyuki, Nakamura, Tsutomu |
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| Zdroj: | 2015 International Conference on Electronic Packaging & iMAPS All Asia Conference (ICEP-IAAC); 2015, p74-77, 4p |
| Databáze: | Complementary Index |
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