Characterization of Cu-Sn SLID interconnects for harsh environment applications.
| Autor: | Campos-Zatarain, A., Flynn, D., Aasmundtveit, K. E., Hoivik, N., Wang, K., Liu, H., Luu, T. T., Mirgkizoudi, M., Kay, R. W. |
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| Zdroj: | 2014 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP); 2014, p1-5, 5p |
| Databáze: | Complementary Index |
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