Hybrid silicon and glass interposer for combined optical and memory system-in-package.
| Autor: | Uematsu, Yutaka, Toyama, Masahiro, Yorita, Chiko, Osaka, Hideki |
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| Zdroj: | 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS); 2014, p5-8, 4p |
| Databáze: | Complementary Index |
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