Reliability of 3D package using wafer level underfill and low CTE epoxy mold compound materials.
| Autor: | Cadacio, F., Rebibis, K. J., Capuz, G., Daily, R., Gerets, C., Sleeckx, E., Duval, F., Wang, T., Miller, R. A., Beyer, G., Beyne, E. |
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| Zdroj: | 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC); 2014, p444-448, 5p |
| Databáze: | Complementary Index |
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