Alternative package-on-package with organic substrate interposer for stacking packaging solution.
| Autor: | Lin, Steven, Liao, Mark, Lan, Albert, Wang, David |
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| Zdroj: | 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC); 2014, p250-253, 4p |
| Databáze: | Complementary Index |
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