Flip chip packaging with pre-molded coreless substrate.
| Autor: | Tang, Tom, Lan, Albert, Tsai, Jensen, Chang, Ivan, Chen, Evan |
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| Zdroj: | 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC); 2014, p200-203, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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