Palladium deactivation pretreatment process for electroless nickel immersion gold process (ENIG): Elimination of metal plating at non-plated through holes (NPTH).
| Autor: | Liu, Lok Lok, Chan, Chun Man, Chan, Chit Yiu, Yee, Kwok Wai |
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| Zdroj: | 2014 9th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 2014, p263-266, 4p |
| Databáze: | Complementary Index |
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