Energy scavenging and storage using through silicon vias to reduce power consumption in 3D ICs.
| Autor: | Minvielle, Robert, Bayoumi, Magdy |
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| Zdroj: | 2014 21st IEEE International Conference on Electronics, Circuits & Systems (ICECS); 2014, p219-222, 4p |
| Databáze: | Complementary Index |
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