On Enhancing Power Benefits in 3D ICs.
| Autor: | Jung, Moongon, Song, Taigon, Wan, Yang, Peng, Yarui, Lim, Sung Kyu |
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| Zdroj: | Proceedings of the the 51st Annual Design Automation Conference Design Automation Conference; 6/1/2014, p1-6, 6p |
| Databáze: | Complementary Index |
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